Nadja Kirchhof


nuSIM: Deutsche Telekom leads development of integrated SIM for IoT

  • Significant cost, time and space savings along the IoT value chain 
  • Industry-leading chipset, module and digital security partners on board
  • Commercially available in the second half of 2019

Deutsche Telekom leads development of integrated SIM for IoT

Deutsche Telekom continues to innovate its European and US IoT service offering. The company has brought industry-leading partners together to develop nuSIM, a ground-breaking solution which moves the SIM functionality from the physical SIM card directly to the chipset. nuSIM is specifically designed for low-cost devices used in mobile IoT applications with a long life-span, such as asset trackers or smart motion or temperature sensors. It will be commercially available in the second half of 2019.

“Deutsche Telekom has built a solid track record in IoT technology innovation over the past years. The most important success driver for us is to anticipate customer needs to make sure we enable their business success,” says Ingo Hofacker, Senior Vice President, responsible for the IoT business at Deutsche Telekom. “nuSIM, our rigorously optimized SIM solution for the cost-sensitive mobile IoT market is our latest endeavor and an important building block for our offering moving forward.” 

Making it simple!

The elimination of the physical SIM card simplifies the form factor of an IoT device as there are no additional contacts, circuit paths or SIM card holders to consider. nuSIM provides a minimum hardware and software footprint for cost-efficient implementations with minimal power consumption.  

This brings simplicity as well as cost and time savings along the IoT value chain. Device vendors benefit from better design options due to smaller package size and extended battery life. SIM logistics, such as stock keeping or handling, are no longer necessary. IoT service providers can save costs through a simple digital process which puts the operator's credentials onto the device during manufacturing time. Customers also benefit from the lower device cost. In addition, they can start their mobile IoT project quicker and easier since a fully operational SIM is already on board.

Partnering is key to success

Deutsche Telekom has partnered with world leaders in the respective fields of IoT chipsets, modules and digital security to cooperate on nuSIM. An open specification set ensures interoperability for the secure provisioning of operator credentials during module or device production. The partners include: 

  • for chipsets: Altair Semiconductor, Commsolid/Goodix, HiSilicon, Nordic Semiconductor, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, Samsung Electronics, Sequans Communications, 
  • for modules: Quectel Wireless Solutions, Sierra Wireless, Telit, u-blox, Nordic Semiconductor.
  • for digital security: Giesecke+Devrient Mobile Security.

Deutsche Telekom is ready to share the technology with other operators and vendors in the IoT segment to establish a viable eco-system. Interested parties are welcome to join.

Driver in mobile IoT innovation

nuSIM is just one of the initiatives Deutsche Telekom is working on to drive innovation in the mobile IoT ecosystem. Most recently, the company conducted the world`s largest NB-IoT indoor measurement campaign together with energy service provider ista. The campaign established that NB-IoT significantly outperforms existing technologies such as GSM, UMTS and LTE for in-building coverage. Deutsche Telekom has also fostered innovation in the LTE-M arena. Its hubraum LTE-M prototyping program has brought forward pioneering solutions across several industry sectors, most notably in the areas of Smart City, Wearables, E-Health and Smart Tracking.

Deutsche Telekom has to date rolled out NB-IoT across nine countries in its European footprint as well as the United States. LTE-M is due to be rolled out as of mid-2019 in several of Deutsche Telekom’s European markets.

nuSIM is one of many solutions Deutsche Telekom offers around the future digital society. More at the MWC Barcelona from 25th to 28th of February 2019. Visit us at our stand 3M31 in hall 3 or participate in the Integrated SIM session on Wednesday, 27th February from 1.00-1.45 pm, also on our stand.

For more information, please visit